Laser Micro Cutting & Dicing Features
Various laser dicing methods: Bessel beam, stealth dicing, filamentation, etc.
Irregular shapes cutting
Low chipping (<10 um)
Minimum heat affected zone (HAZ)
High process speed
Possible Machined Materials
Polyimide (PI)
Polyester (PET)
Metal Foil
Organic Film
Polymethyl Methacrylate (PMMA)
Liquid Crystal Polymer (LCP)
Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
Coverlay (Polyimide + Adhesive)
Copper-clad polyimide laminates with adhesive
Any material with thickness smaller than 0.5 mm is also possible
Related Applications
Thin-film panel cutting.
PI substrate lift-off from glass (Laser Lift-Off, LLO).
Glass cutting (breaking) without damages of bottom film and/or metal circuit.
Film half-cutting without damages of bottom film and/or metal circuit.
Periodic microstructure
Direct laser engraving of flexographic plates and cylinders
Sub-surface laser engraving (SSLE)8. Direct photopolymer laser imaging
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