Films Ablation Machine


FAMous is designed to provide micromachined films fabrication with an excellent quality and a high throughput, which can be applied to the solution of the flexible panel processing. According to customers' requests, generally, the machining quality, including the cutting width, crater, burr and HAZ, will be the dominant factor for the product processings. Furthermore, the takt time is definitely a crucial criterion for a laser processing machine. SUPERBIN's R&D-Technology team has invested a lot of manpower and resources in the development of laser processing machines that can meet customers' requirements. In order to achieve the excellent performance, an ultrafast diode-pumped solid-state laser and an optimized optical module have been equipped inside the machine. Also, a granite base is used for supporting the whole machine that can provide a high-stability and high-accuracy workbench. In addition, the "Customized Solution" means that it's designed not only for the machine but also for the user/operator. SUPERBCON, a superb software/control system, is also adopted, which gives the operator a WYSIWYG interface. Conclusively, FAMous is a reliable facility with an excellent machining quality, a user-friendly control interface and a robust mechanical structure.


Possible Machined Materials:

1. Polyimide (PI)

2. Polyester (PET)

3. Metal Foil

4. Organic Film

5. Polymethyl Methacrylate (PMMA)

6. Liquid Crystal Polymer (LCP)

7. Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)

8. Coverlay (Polyimide + Adhesive)

9. Copper-clad polyimide laminates with adhesive

10. Any material with thickness smaller than 0.5 mm is also possible

Related Applications

1. Thin-film panel cutting.

2. PI substrate lift-off from glass (Laser Lift-Off, LLO).

3. Glass cutting (breaking) without damages of bottom film and/or metal circuit.

4. Film half-cutting without damages of bottom film and/or metal circuit.

5. Periodic microstructure

6. Direct laser engraving of flexographic plates and cylinders

7. Sub-surface laser engraving (SSLE)

8. Direct photopolymer laser imaging


1-D Ablation for Cutting
Takt Time: > 300 mm/s
Thickness: < 100 μm
Line Width: < 10 μm
Crater Height: < 1 μm
HAZ: < 10 μm

2-D Ablation for Laser Lift-Off (LLO)
Takt Time: > 600 mm2/s
Material: PI
Substrate: glass, sapphire, or other material with a high transmittance for the used laser
Ablation Depth: < 1 μm
HAZ: PI with a high transmittance after LLO

2-D Ablation for Other Applications
Takt Time: > 1 mm3/s
Burr Height: < 10 μm
Taper Angle: < 1 degree
Crater Height: < 1 μm
HAZ: < 50 μm